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Packaging |
Bulk |
Features |
Closed Frame |
Mounting Type |
Through Hole |
Type |
SOIC |
Operating Temperature |
-55°C ~ 150°C |
Number of Positions or Pins (Grid) |
8 (2 x 4) |
Termination |
Solder |
Housing Material |
Polyethersulfone (PES), Glass Filled |
Pitch - Mating |
- |
Contact Finish - Mating |
Gold |
Contact Finish Thickness - Mating |
30.0µin (0.76µm) |
Contact Material - Mating |
Beryllium Copper |
Pitch - Post |
- |
Contact Finish - Post |
Gold |
Contact Finish Thickness - Post |
30.0µin (0.76µm) |
Contact Material - Post |
Beryllium Copper |
8 (2 x 4) Pos SOIC Socket Gold Through Hole