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Packaging |
Bulk |
Features |
Open Frame |
Mounting Type |
Through Hole |
Type |
QFN |
Operating Temperature |
- |
Number of Positions or Pins (Grid) |
88 (4 x 22) |
Termination |
Solder |
Housing Material |
Polyethersulfone (PES) |
Pitch - Mating |
0.016" (0.40mm) |
Contact Finish - Mating |
Gold |
Contact Finish Thickness - Mating |
- |
Contact Material - Mating |
Beryllium Copper |
Pitch - Post |
0.016" (0.40mm) |
Contact Finish - Post |
Gold |
Contact Finish Thickness - Post |
- |
Contact Material - Post |
Beryllium Copper |
88 (4 x 22) Pos QFN Socket Gold Through Hole